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Philips Semiconductors

Product specification

 

 

Silicon Diffused Power Transistor

BU2506DF

 

 

 

 

GENERAL DESCRIPTION

Enhanced performance, new generation, high-voltage, high-speed switching npn transistor with an integrated damper diode in a plastic full-pack envelope intended for use in horizontal deflection circuits of colour television receivers. Features exceptional tolerance to base drive and collector current load variations resulting in a very low worst case dissipation.

QUICK REFERENCE DATA

SYMBOL

PARAMETER

CONDITIONS

TYP.

MAX.

UNIT

 

 

 

 

 

 

VCESM

Collector-emitter voltage peak value

VBE = 0 V

-

1500

V

VCEO

Collector-emitter voltage (open base)

 

-

700

V

IC

Collector current (DC)

 

-

5

A

ICM

Collector current peak value

Ths 25 ˚C

-

8

A

Ptot

Total power dissipation

-

45

W

VCEsat

Collector-emitter saturation voltage

IC = 3.0 A; IB = 1.0 A

-

1.0

V

ICsat

Collector saturation current

IF = 3.0 A

3.0

-

A

VF

Diode forward voltage

1.6

2.0

V

tf

Fall time

ICM = 3.0 A; IB(end) = 0.67 A

0.25

0.5

μs

PINNING - SOT199

PIN CONFIGURATION

SYMBOL

PIN

DESCRIPTION

 

c

 

 

case

1

base

 

 

 

2

collector

 

b

3

emitter

 

 

Rbe

 

 

 

case

isolated

1 2 3

e

 

 

LIMITING VALUES

Limiting values in accordance with the Absolute Maximum Rating System (IEC 134)

SYMBOL

PARAMETER

CONDITIONS

MIN.

MAX.

UNIT

 

 

 

 

 

 

VCESM

Collector-emitter voltage peak value

VBE = 0 V

-

1500

V

VCEO

Collector-emitter voltage (open base)

 

-

700

V

IC

Collector current (DC)

 

-

5

A

ICM

Collector current peak value

 

-

8

A

IB

Base current (DC)

 

-

3

A

IBM

Base current peak value

 

-

5

A

-IB(AV)

Reverse base current

average over any 20 ms period

-

100

mA

-I

Reverse base current peak value 1

 

-

4

A

BM

 

Ths 25 ˚C

 

 

 

Ptot

Total power dissipation

-

45

W

Tstg

Storage temperature

 

-65

150

˚C

Tj

Junction temperature

 

-

150

˚C

1 Turn-off current.

November 1995

1

Rev 1.100

Philips Semiconductors

Product specification

 

 

Silicon Diffused Power Transistor

BU2506DF

 

 

THERMAL RESISTANCES

SYMBOL

PARAMETER

CONDITIONS

TYP.

MAX.

UNIT

 

 

 

 

 

 

Rth j-hs

Junction to heatsink

without heatsink compound

-

3.7

K/W

Rth j-hs

Junction to heatsink

with heatsink compound

-

2.8

K/W

Rth j-a

Junction to ambient

in free air

32

-

K/W

ISOLATION LIMITING VALUE & CHARACTERISTIC

Ths = 25 ˚C unless otherwise specified

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

Visol

Repetitive peak voltage from all

R.H. 65 % ; clean and dustfree

-

 

2500

V

 

three terminals to external

 

 

 

 

 

 

heatsink

 

 

 

 

 

Cisol

Capacitance from T2 to external

f = 1 MHz

-

22

-

pF

 

heatsink

 

 

 

 

 

STATIC CHARACTERISTICS

Ths = 25 ˚C unless otherwise specified

SYMBOL

PARAMETER

CONDITIONS

 

 

MIN.

TYP.

MAX.

UNIT

 

 

 

 

 

 

 

 

 

 

 

I

Collector cut-off current 2

V =

0 V; V

CE

= V

CESMmax

-

-

1.0

mA

CES

 

BE

 

 

 

 

 

 

ICES

 

VBE =

0 V; VCE = VCESMmax;

-

-

2.0

mA

IEBO

 

Tj = 125 ˚C

 

 

 

 

 

 

 

Emitter cut-off current

VEB =

7.5 V; IC = 0 A

90

-

180

mA

BVEBO

Emitter-base breakdown voltage

IB = 600 mA

 

 

 

7.5

13.5

-

V

Rbe

Base-emitter resistance

VEB =

7.5 V

 

 

 

40

60

80

Ω

VCEOsust

Collector-emitter sustaining voltage

IB = 0 A; IC = 100 mA;

700

-

-

V

 

 

L = 25 mH

 

 

 

 

 

 

 

VCEsat

Collector-emitter saturation voltage

IC = 3.0 A; IB = 1.0 A

-

-

1.0

V

VBEsat

Base-emitter saturation voltage

IC = 3.0 A; IB = 1.1

A

-

-

1.3

V

hFE

DC current gain

IC = 0.3 A; VCE = 5

V

7

12

19

 

hFE

 

IC = 3.0 A; VCE = 5

V

3.8

5.5

7.5

 

VF

Diode forward voltage

IF = 3.0 A

 

 

 

-

1.6

2.0

V

DYNAMIC CHARACTERISTICS

Ths = 25 ˚C unless otherwise specified

SYMBOL

PARAMETER

CONDITIONS

TYP.

MAX.

UNIT

 

 

 

 

 

 

Cc

Collector capacitance

IE = 0 A; VCB = 10 V; f = 1 MHz

47

-

pF

 

Switching times (line deflection

ICM = 3.0 A; LC = 1.35 mH;

 

 

 

 

circuit)

CFB = 9.4 nF; IB(end) = 0.67 A;

 

 

 

 

 

LB = 8 μH; -VBB = 4 V;

 

 

 

ts

Turn-off storage time

(-dIB/dt = 0.45 A/μs)

4.5

6.0

μs

 

tf

Turn-off fall time

 

0.25

0.5

μs

2 Measured with half sine-wave voltage (curve tracer).

November 1995

2

Rev 1.100

Philips Semiconductors

Product specification

 

 

Silicon Diffused Power Transistor

BU2506DF

 

 

 

ICM

 

TRANSISTOR

IC

DIODE

 

t

IB

IBend

 

t

20us

26us

64us

VCE

t

Fig.1. Switching times waveforms.

h FE

100

 

 

 

 

Tj = 25 C

 

 

 

Tj = 125 C

 

5V

 

 

 

10

 

 

 

 

1V

 

 

1

0.1

1

10

0.01

 

IC / A

 

 

Fig.4. Typical DC current gain. hFE = f (IC) parameter VCE

 

 

ICM

1.2

VBESAT / V

 

 

 

 

90 %

 

 

 

 

 

 

 

 

 

 

 

 

 

 

1.1

 

Tj = 25 C

 

 

IC

 

 

1

 

Tj = 125 C

 

 

 

 

 

 

 

 

 

 

 

 

0.9

 

 

 

 

 

 

10 %

 

 

 

 

 

 

tf

t

0.8

 

 

IC/IB =

 

 

 

 

 

ts

 

 

 

3

 

IB

 

0.7

 

 

 

 

 

 

 

4

 

IBend

 

 

 

 

 

 

 

 

 

 

 

 

 

0.6

 

 

5

 

 

 

 

 

 

 

 

 

t

0.5

 

 

 

 

 

 

 

 

 

 

 

 

 

 

0.4

0.1

1

IC / A

10

 

 

- IBM

 

Fig.2.

Switching times definitions.

Fig.5.

Typical base-emitter saturation voltage.

 

 

 

 

 

VBEsat = f (IC); parameter IC/IB

 

 

 

+ 150 v nominal

1

VCESAT / V

 

 

 

 

adjust for ICM

 

 

 

 

 

 

0.9

 

IC/IB =

 

 

 

 

 

 

 

 

 

 

 

 

5

 

 

 

 

 

0.8

 

 

 

 

 

 

 

4

 

 

 

 

 

 

 

 

 

 

 

Lc

0.7

 

3

 

 

 

 

 

 

 

 

 

 

 

 

0.6

 

 

 

 

 

 

 

0.5

 

Tj = 25 C

 

 

 

 

 

 

 

 

 

 

D.U.T.

 

0.4

 

Tj = 125 C

 

 

IBend

LB

Cfb

0.3

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

0.2

 

 

 

 

-VBB

Rbe

 

0.1

 

 

 

 

 

 

 

0

0.1

1

IC / A

10

 

 

 

 

Fig.3.

Switching times test circuit.

Fig.6.

Typical collector-emitter saturation voltage.

 

 

 

 

 

VCEsat = f (IC); parameter IC/IB

 

November 1995

 

 

3

 

 

 

Rev 1.100

Philips Semiconductors

Product specification

 

 

Silicon Diffused Power Transistor

BU2506DF

 

 

VBESAT / V

 

 

 

 

1.2

 

 

 

 

 

 

Tj = 25 C

 

 

 

 

1.1

Tj = 125 C

 

 

 

 

1

 

 

 

 

 

0.9

 

 

 

 

 

 

 

 

 

IC =

 

0.8

 

 

 

4A

 

 

 

 

3A

 

 

 

 

 

 

0.7

 

 

 

2.5A

 

 

 

 

 

 

0.6

 

 

 

 

 

0

1

2

3

IB / A

4

 

 

 

 

 

Fig.7. Typical base-emitter saturation voltage. VBEsat = f (IB); parameter IC

VCESAT / V

 

 

 

10

 

 

 

IC = 2.5A

 

Tj = 25 C

 

3A

 

Tj = 125 C

 

 

 

 

4A

 

 

 

1

 

 

 

0.1

 

 

 

0.1

1

IB / A

10

Fig.8. Typical collector-emitter saturation voltage. VCEsat = f (IB); parameter IC

Eoff / uJ

1000

 

IC = 3A

 

 

100

2.5A

 

 

 

 

 

10

 

 

 

0.1

1

IB / A

10

 

 

 

Fig.9. Typical turn-off losses. Tj = 85˚C Eoff = f (IB); parameter IC

ts, tf / us

10

9

ts

 

8

7

6

5

4

IC =

3

 

 

 

 

3A

 

 

 

2

 

 

 

2.5A

 

 

 

 

 

 

 

 

 

 

1

 

 

 

 

 

 

tf

 

0

0.1

 

 

 

1

 

 

10

 

 

 

 

IB / A

 

 

 

 

 

 

 

Fig.10. Typical collector storage and fall time.

ts = f (IB); tf = f (IB); parameter IC; Tj = 85˚C

120

PD%

 

 

Normalised Power Derating

 

 

 

 

 

 

 

 

 

 

 

with heatsink compound

110

 

 

 

 

 

 

 

 

 

 

 

 

 

100

 

 

 

 

 

 

 

 

90

 

 

 

 

 

 

 

 

80

 

 

 

 

 

 

 

 

70

 

 

 

 

 

 

 

 

60

 

 

 

 

 

 

 

 

50

 

 

 

 

 

 

 

 

40

 

 

 

 

 

 

 

 

30

 

 

 

 

 

 

 

 

20

 

 

 

 

 

 

 

 

10

 

 

 

 

 

 

 

 

0

0

20

40

60

80

100

120

140

 

 

 

 

 

 

Ths / C

 

 

 

Fig.11.

Normalised power dissipation.

 

 

PD% = 100×PD/PD 25˚C = f (Ths)

 

November 1995

4

Rev 1.100

Philips Semiconductors

Product specification

 

 

Silicon Diffused Power Transistor

BU2506DF

 

 

IC / A

 

 

 

100

 

 

 

 

 

= 0.01

 

ICM max

 

 

 

10

 

 

tp =

 

 

 

IC max

 

 

10 us

 

 

 

 

 

 

II

1

Ptot max

 

 

 

 

 

 

 

 

100 us

 

 

 

1 ms

 

I

 

 

0.1

 

 

 

 

 

 

10 ms

 

 

 

DC

0.01

 

 

 

1

10

100

1000

 

 

 

VCE / V

Fig.12. Forward bias safe operating area. Ths = 25˚C I Region of permissible DC operation.

II Extension for repetitive pulse operation.

NB: Mounted with heatsink compound and 30 ± 5 newton force on the centre of the envelope.

IC / A

 

 

 

100

 

 

 

 

 

= 0.01

 

ICM max

 

 

tp =

10

 

 

 

IC max

 

 

10 us

 

 

 

 

 

 

II

1

 

 

 

 

Ptot max

 

 

 

 

 

100 us

 

 

 

1 ms

 

I

 

 

0.1

 

 

 

 

 

 

10 ms

 

 

 

DC

0.01

 

 

 

1

10

100

1000

 

 

 

VCE / V

Fig.13. Forward bias safe operating area. Ths = 25˚C I Region of permissible DC operation.

II Extension for repetitive pulse operation.

NB: Mounted without heatsink compound and 30 ± 5 newton force on the centre of

the envelope.

November 1995

5

Rev 1.100

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