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MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Order this document by MCR8DSM/D

Silicon Controlled Rectifiers

Reverse Blocking Thyristors

Designed for high volume, low cost, industrial and consumer applications such as motor control; process control; temperature, light and speed control.

Small Size

 

Passivated Die for Reliability and Uniformity

 

Low Level Triggering and Holding Characteristics

A

Available in Two Package Styles

 

Surface Mount Lead Form Ð Case 369A

 

Miniature Plastic Package Ð Straight Leads Ð Case 369

 

ORDERING INFORMATION

G

To Obtain ªDPAKº in Surface Mount Leadform (Case 369A)

 

Shipped in Sleeves Ð No Suffix, i.e. MCR8DSN

K

Shipped in 16 mm Tape and Reel Ð Add ªT4º Suffix to Device Number,

 

i.e. MCR8DSNT4

 

To Obtain ªDPAKº in Straight Lead Version (Case 369) Shipped in Sleeves Ð Add ª±1º Suffix to Device Number, i.e. MCR8DSN±1

MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)

MCR8DSM

MCR8DSN

Motorola Preferred Devices

SCRs

8.0 AMPERES RMS

600 thru 800 VOLTS

A

K

A G

CASE 369A±13

STYLE 4

Rating

 

Symbol

Value

Unit

 

 

 

 

 

Peak Repetitive Off±State Voltage (1)

 

V

 

Volts

 

 

DRM

 

 

Peak Repetitive Reverse Voltage

 

VRRM

 

 

(TJ = ±40 to 110°C, RGK = 1.0 KW)

MCR8DSM

 

600

 

 

MCR8DSN

 

800

 

 

 

 

 

 

On±State RMS Current

 

IT(RMS)

 

Amps

(All Conduction Angles; TC = 90°C)

 

 

8.0

 

Average On±State Current (All Conduction Angles; TC = 90°C)

IT(AV)

5.1

 

Peak Non±Repetitive Surge Current

 

ITSM

 

 

(One Half Cycle, 60 Hz, TJ = 110°C)

 

 

90

 

Circuit Fusing Consideration (t = 8.3 msec)

 

I2t

34

A2sec

Peak Gate Power

 

PGM

 

Watts

(Pulse Width ≤ 10 msec, TC = 90°C)

 

 

5.0

 

Average Gate Power

 

PG(AV)

 

 

(t = 8.3 msec, TC = 90°C)

 

 

0.5

 

Peak Gate Current (Pulse Width ≤ 10 sec,m

TC = 90°C)

IGM

2.0

Amps

Operating Junction Temperature Range

 

TJ

±40 to 110

°C

Storage Temperature Range

 

Tstg

±40 to 150

 

THERMAL CHARACTERISTICS

 

 

 

 

Characteristic

Symbol

Max

Unit

 

 

 

 

Thermal Resistance Ð Junction to Case

RqJC

2.2

°C/W

Ð Junction to Ambient

RqJA

88

 

Ð Junction to Ambient (2)

RqJA

80

 

Maximum Lead Temperature for Soldering Purposes (3)

T

260

°C

 

L

 

 

(1)VDRM for all types can be applied on a continuous basis. Ratings apply for negative gate voltage or RGK = 1.0 KW; positive gate voltage shall not be applied concurrent with negative potential on the anode. Blocking voltages shall not be tested with a constant current source such that the voltage ratings of the device are exceeded.

(2)Surface mounted on minimum recommended pad size.

(3)1/8″ from case for 10 seconds.

Preferred devices are Motorola recommended choices for future use and best overall value.

Motorola Thyristor Device Data

Motorola, Inc. 1997

MCR8DSM

MCR8DSN

 

 

 

 

 

 

ELECTRICAL CHARACTERISTICS (TJ = 25°C; RGK = 1.0 KW unless otherwise noted)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Characteristics

 

Symbol

Min

Typ

Max

Unit

 

 

 

 

 

 

 

Peak Reverse Gate Blocking Voltage

 

VGRM

10

12.5

18

Volts

(IGR = 10 mA)

 

 

 

 

 

 

Peak Forward Blocking Current

 

IDRM

 

 

 

mA

Peak Reverse Blocking Current

 

IRRM

 

 

 

 

(V = Rated V

or V

) (1)

T = 25°C

 

Ð

Ð

10

 

AK

DRM

 

RRM

J

 

 

 

 

 

 

 

 

 

TJ = 110°C

 

Ð

Ð

500

 

Peak Reverse Gate Blocking Current

 

IRGM

 

 

 

mA

(VGR = 10 V)

 

 

 

 

 

Ð

Ð

1.2

 

Peak On±State Voltage (2)

 

 

V

 

 

 

Volts

(ITM = 16 A)

 

 

 

 

TM

Ð

1.4

1.8

 

 

 

 

 

 

 

Gate Trigger Current (Continuous dc) (3)

 

I

 

 

 

mA

(VD = 12 V, RL = 100 W, TJ = 25°C)

 

GT

5.0

12

200

 

 

 

 

(VD = 12 V, RL = 100 W, TJ = ±40°C)

 

 

Ð

Ð

300

 

Gate Trigger Voltage (Continuous dc)

 

VGT

 

 

 

Volts

(VD = 12 V, RL = 100 W, TJ = 25°C)

 

 

0.45

0.65

1.0

 

(VD = 12 V, RL = 100 W, TJ = ±40°C)

 

 

Ð

Ð

1.5

 

(VD = 12 V, RL = 100 W, TJ = 110°C)

 

 

0.2

Ð

Ð

 

Holding Current

 

 

 

 

IH

 

 

 

mA

(VD = 12 V, I(init) = 200 mA, TJ = 25°C)

 

 

0.5

1.0

6.0

 

(VD = 12 V, I(init) = 200 mA, TJ = ±40°C)

 

 

Ð

Ð

10

 

Latching Current

 

 

 

 

IL

 

 

 

mA

(VD = 12 V, IG = 2.0 mA, TJ = 25°C)

 

 

0.5

1.0

6.0

 

(VD = 12 V, IG = 2.0 mA, TJ = ±40°C)

 

 

Ð

Ð

10

 

DYNAMIC CHARACTERISTICS

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Characteristics

 

Symbol

Min

Typ

Max

Unit

 

 

 

 

 

 

 

 

 

Total Turn±On Time

 

 

 

tgt

 

 

 

ms

(Source Voltage = 12 V, RS = 6.0 KW, IT = 16 A(pk), RGK = 1.0 KW)

 

Ð

2.0

5.0

 

(VD = Rated VDRM, Rise Time = 20 ns, Pulse Width = 10 ms)

 

 

 

 

 

Critical Rate of Rise of Off±State Voltage

 

dv/dt

 

 

 

V/ms

(VD = 0.67 X Rated VDRM, Exponential Waveform,

 

 

2.0

10

Ð

 

RGK = 1.0 KW, TJ = 110°C)

 

 

 

 

 

 

(1)Ratings apply for negative gate voltage or RGK = 1.0 KW. Devices shall not have a positive gate voltage concurrently with a negative voltage on the anode. Devices should not be tested with a constant current source for forward and reverse blocking capability such that the voltage applied exceeds the rated blocking voltage.

(2)Pulse Test; Pulse Width 2.0 msec, Duty Cycle 2%.

(3)Does not include RGK current.

2

Motorola Thyristor Device Data

°C)

110

 

 

 

 

 

 

 

 

 

 

 

 

 

(

 

 

 

 

 

 

 

TEMPERATURE

105

 

 

 

 

 

 

 

 

 

 

 

 

a

100

 

 

 

 

a = Conduction

 

 

 

 

Angle

CASE

 

 

 

 

 

 

 

 

 

 

 

 

ALLOWABLE

95

 

 

 

 

 

 

 

 

 

 

 

 

dc

90

 

 

 

 

 

 

 

 

 

 

 

 

 

MAXIMUM

 

 

a = 30°

60°

90°

120°

180°

85

 

 

 

 

 

 

0

1.0

2.0

3.0

4.0

5.0

6.0

,

 

 

 

 

 

 

 

C

 

IT(AV), AVERAGE ON±STATE CURRENT (AMPS)

 

T

 

 

 

 

 

 

MCR8DSM

MCR8DSN

(WATTS)

12

 

 

 

 

 

 

 

10

 

 

 

 

 

 

 

DISSIPATION

 

 

 

 

 

 

 

 

a

 

 

 

 

 

180°

8.0

a = Conduction

 

 

90°

120°

 

 

 

 

 

 

 

 

 

Angle

 

 

 

 

dc

 

 

 

 

 

 

POWER

6.0

a = 30°

60°

 

 

 

 

 

 

 

 

 

 

4.0

 

 

 

 

 

 

 

, AVERAGE

 

 

 

 

 

 

 

2.0

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

(AV)

0

 

 

 

 

 

 

 

P

1.0

2.0

3.0

4.0

 

5.0

6.0

 

0

 

IT(AV), AVERAGE ON±STATE CURRENT (AMPS)

Figure 1. Average Current Derating

Figure 2. On±State Power Dissipation

CURRENT(AMPS)

100

TYPICAL @ TJ = 25°C

 

 

 

 

 

1.0

 

 

 

 

RESISTANCE

 

 

 

 

 

MAXIMUM @ TJ = 110°C

 

 

10

 

 

 

 

 

 

 

, INSTANTANEOUS ON±STATE

 

 

 

 

 

THERMAL

(NORMALIZED)

 

 

 

 

 

 

 

0.1

 

 

MAXIMUM @ TJ = 25°C

 

 

 

1.0

 

 

 

, TRANSIENT

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

(t)

 

0.1

 

 

 

 

 

r

0.01

T

0

1.0

2.0

3.0

4.0

5.0

 

 

 

I

 

 

 

 

 

 

 

 

 

VT, INSTANTANEOUS ON±STATE VOLTAGE (VOLTS)

 

 

 

 

 

 

 

ZqJC(t) = RqJC(t)Sr(t)

 

0.1

1.0

10

100

1000

10 K

t, TIME (ms)

Figure 3. On±State Characteristics

Figure 4. Transient Thermal Response

1000

 

 

 

 

 

 

 

 

 

1.0

 

 

 

 

 

 

 

 

RGK = 1.0 KW

GATE TRIGGER VOLTAGE (VOLTS)

100

 

 

 

 

 

 

 

 

 

10

 

 

 

 

GATE OPEN

 

 

 

 

 

 

 

 

 

 

 

 

CURRENTTRIGGER, GATEA)m(

 

 

 

 

 

 

 

 

 

GT

 

 

 

 

 

 

 

 

 

,

I

 

 

 

 

 

 

 

 

 

GT

 

 

 

 

 

 

 

 

 

 

V

1.0

 

 

 

 

35

 

 

 

 

0.1

±40

±25

±10

5.0

20

50

65

80

95

110

 

 

 

TJ, JUNCTION TEMPERATURE (°C)

 

 

±40

±25

±10

5.0

20

35

50

65

80

95

110

 

 

 

TJ, JUNCTION TEMPERATURE (°C)

 

 

 

Figure 5. Typical Gate Trigger Current versus

Figure 6. Typical Gate Trigger Voltage versus

Junction Temperature

Junction Temperature

Motorola Thyristor Device Data

3

MCR8DSM

MCR8DSN

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

10

 

 

 

 

 

 

 

 

 

 

 

10

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

RGK = 1.0 KW

 

 

 

 

 

 

 

 

 

 

RGK = 1.0 KW

 

 

CURRENT (mA)

1.0

 

 

 

 

 

 

 

 

 

 

CURRENT (mA)

1.0

 

 

 

 

 

 

 

 

 

 

, HOLDING

 

 

 

 

 

 

 

 

 

 

 

LATCHING

 

 

 

 

 

 

 

 

 

 

 

H

 

 

 

 

 

 

 

 

 

 

 

,

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

L

 

 

 

 

 

 

 

 

 

 

 

I

 

 

 

 

 

 

 

 

 

 

 

I

 

 

 

 

 

 

 

 

 

 

 

 

0.1

 

 

 

 

 

 

 

 

 

 

 

0.1

 

 

 

 

 

 

 

 

 

 

 

±40

±25

±10

5.0

20

35

50

65

80

95

110

 

±40

±25

±10

5.0

20

35

50

65

80

95

110

 

 

 

 

TJ, JUNCTION TEMPERATURE (°C)

 

 

 

 

 

 

 

TJ, JUNCTION TEMPERATURE (°C)

 

 

 

Figure 7. Typical Holding Current versus

Figure 8. Typical Latching Current versus

Junction Temperature

Junction Temperature

 

10

 

 

 

 

TJ = 25°C

 

(mA)

8.0

 

 

 

 

 

CURRENT

6.0

 

 

 

IGT = 25 mA

 

, HOLDING

4.0

 

 

 

 

 

H

2.0

IGT = 10 mA

 

I

 

 

 

 

0

 

 

 

100

1000

10 K

 

 

RGK, GATE±CATHODE RESISTANCE (OHMS)

 

Figure 9. Holding Current versus

Gate±Cathode Resistance

 

1000

 

s)

100

70°C

m

 

(V/

 

 

dv/dt

 

90°C

 

TJ = 110°C

STATIC

 

10

 

 

1.0

 

 

100

1000

RGK, GATE±CATHODE RESISTANCE (OHMS)

Figure 10. Exponential Static dv/dt versus

Gate±Cathode Resistance and Junction

Temperature

 

1000

 

 

1000

 

 

 

TJ = 110°C

 

 

 

400 V

 

 

s)

100

600 V

s)

100

(V/ m

(V/m

 

 

 

 

 

dv/dt

 

VPK = 800 V

dv/dt

 

STATIC

 

STATIC

 

10

 

10

 

1.0

 

 

1.0

 

100

 

1000

 

 

VD = 800 V

 

TJ = 110°C

 

IGT = 25 mA

 

IGT = 10 mA

100

1000

RGK, GATE±CATHODE RESISTANCE (OHMS)

RGK, GATE±CATHODE RESISTANCE (OHMS)

Figure 11. Exponential Static dv/dt versus

Figure 12. Exponential Static dv/dt versus

Gate±Cathode Resistance and Peak Voltage

Gate±Cathode Resistance and Gate Trigger

 

Current Sensitivity

4

Motorola Thyristor Device Data

MCR8DSM MCR8DSN

PACKAGE DIMENSIONS

±T± SEATINGPLANE

 

B

C

V

R

E

 

4

 

Z

 

 

 

S

 

 

A

 

 

 

1

2

3

U

 

 

 

 

 

 

K

F

 

 

J

 

 

L

H

 

 

 

D 2 PL

G

0.13 (0.005) M T

NOTES:

1.DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.

2.CONTROLLING DIMENSION: INCH.

 

INCHES

MILLIMETERS

DIM

MIN

MAX

MIN

MAX

A

0.235

0.250

5.97

6.35

B

0.250

0.265

6.35

6.73

C

0.086

0.094

2.19

2.38

D

0.027

0.035

0.69

0.88

E

0.033

0.040

0.84

1.01

F

0.037

0.047

0.94

1.19

G

0.180 BSC

4.58 BSC

H

0.034

0.040

0.87

1.01

J

0.018

0.023

0.46

0.58

K

0.102

0.114

2.60

2.89

L

0.090 BSC

2.29 BSC

R

0.175

0.215

4.45

5.46

S

0.020

0.050

0.51

1.27

U

0.020

±±±

0.51

±±±

V

0.030

0.050

0.77

1.27

Z

0.138

±±±

3.51

±±±

STYLE 4:

PIN 1. CATHODE

2. ANODE

3. GATE

4. ANODE

CASE 369A±13

ISSUE Y

Motorola Thyristor Device Data

5

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