Материал: HGTD3N60

Handling Precautions for IGBTs

Insulated Gate Bipolar Transistors are susceptible to gateinsulation damage by the electrostatic discharge of energy through the devices. When handling these devices, care should be exercised to assure that the static charge built in the handler’s body capacitance is not discharged through the device. With proper handling and application procedures, however, IGBT’s are currently being extensively used in production by numerous equipment manufacturers in military, industrial and consumer applications, with virtually no damage problems due to electrostatic discharge. IGBT’s can be handled safely if the following basic precautions are taken:

1.Prior to assembly into a circuit, all leads should be kept shorted together either by the use of metal shorting springs or by the insertion into conductive material such as † “ECCOSORBD LD26” or equivalent.

2.When devices are removed by hand from their carriers, the hand being used should be grounded by any suitable means - for example, with a metallic wristband.

3.Tips of soldering irons should be grounded.

4.Devices should never be inserted into or removed from circuits with power on.

5.Gate Voltage Rating - Never exceed the gate-voltage rat-

ing of VGEM. Exceeding the rated VGE can result in permanent damage to the oxide layer in the gate region.

6.Gate Termination - The gates of these devices are essentially capacitors. Circuits that leave the gate open-cir- cuited or floating should be avoided. These conditions can result in turn-on of the device due to voltage buildup on the input capacitor due to leakage currents or pickup.

7.Gate Protection - These devices do not have an internal monolithic zener diode from gate to emitter. If gate protection is required an external zener is recommended.

†Trademark Emerson and Cumming, Inc.

Operating Frequency Information

Operating Frequency Information for a Typical Device

Figure 13 is presented as a guide for estimating device performance for a specific application. Other typical frequency vs collector current (ICE) plots are possible using the information shown for a typical unit in Figures 4, 7, 8, 11 and 12. The operating frequency plot (Figure 13) of a typical device

shows fMAX1 or fMAX2 whichever is smaller at each point. The information is based on measurements of a typical

device and is bounded by the maximum rated junction temperature.

fMAX1 is defined by fMAX1 = 0.05/(tD(OFF)I+ tD(ON)I). Deadtime (the denominator) has been arbitrarily held to 10% of

the onstate time for a 50% duty factor. Other definitions are possible. tD(OFF)I and tD(ON)I are defined in Figure 19.

Device turn-off delay can establish an additional frequency limiting condition for an application other than TJMAX.

tD(OFF)I is important when controlling output ripple under a lightly loaded condition.

fMAX2 is defined by fMAX2 = (PD - PC)/(EOFF + EON). The allowable dissipation (PD) is defined by PD = (TJMAX -

TC)/RθJC. The sum of device switching and conduction losses must not exceed PD. A 50% duty factor was used (Figure 13) and the conduction losses (PC) are approximated by PC =

(VCE x ICE)/2. EON and EOFF are defined in the switching waveforms shown in Figure 19. EON is the integral of the

instantaneous power loss (ICE x VCE) during turn-on and EOFF is the integral of the instantaneous power loss (ICE x VCE) during turn-off. All tail losses are included in the calculation for EOFF; i.e. the collector current equals zero (ICE = 0).

Packaging

TERM. 4

SEATING

PLANE

D

b1

L1

L

TO-251AA

3 LEAD JEDEC TO-251AA PLASTIC PACKAGE

NOTES:

1.These dimensions are within allowable dimensions of Rev. C of JEDEC TO-251AA outline dated 9-88.

2.Solder finish uncontrolled in this area.

3.Dimension (without solder).

4.Add typically 0.002 inches (0.05mm) for solder plating.

5.Position of lead to be measured 0.250 inches (6.35mm) from bottom of dimension D.

6.Position of lead to be measured 0.100 inches (2.54mm) from bottom of dimension D.

7.Controlling dimension: Inch.

8.Revision 2 dated 10-95.