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PACKAGE OUTLINE

DBV0005A

SOT-23 - 1.45 mm max height

 

SMALL OUTLINE TRANSISTOR

 

 

 

 

C

 

3.0

 

 

 

 

2.6

 

 

0.1 C

 

1.75

B

A

1.45 MAX

PIN 1

1.45

 

 

 

 

INDEX AREA

 

 

 

 

 

 

 

1

5

 

 

2X

0.95

 

3.05

 

 

 

 

 

 

 

 

 

 

 

 

2.75

 

 

1.9

 

 

2

1.9

 

 

 

 

 

 

 

 

 

 

 

3

4

 

 

5X

0.5

 

 

 

 

 

 

 

 

0.3

 

(1.1)

0.15

TYP

 

0.2 C A B

 

 

 

 

 

0.00

 

 

0.25

 

 

 

GAGE PLANE

 

0.22

TYP

 

 

 

0.08

8

TYP

0.6

 

 

0

 

0.3 TYP

SEATING PLANE

 

4214839/D 11/2018

NOTES:

1.All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M.

2.This drawing is subject to change without notice.

3.Refernce JEDEC MO-178.

4.Body dimensions do not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side.

www.ti.com

 

EXAMPLE BOARD LAYOUT

DBV0005A

SOT-23 - 1.45 mm max height

 

SMALL OUTLINE TRANSISTOR

PKG

 

5X (1.1)

1

 

5X (0.6)

5

 

 

SYMM

2

(1.9)

 

2X (0.95)

 

3

4

(R0.05) TYP

(2.6)

LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN

SCALE:15X

SOLDER MASK

METAL

METAL UNDER

SOLDER MASK

OPENING

OPENING

 

SOLDER MASK

 

 

 

EXPOSED METAL

 

 

EXPOSED METAL

 

 

 

0.07 MAX

 

0.07 MIN

 

 

ARROUND

 

ARROUND

 

NON SOLDER MASK

 

SOLDER MASK

 

 

DEFINED

 

DEFINED

 

 

(PREFERRED)

 

 

SOLDER MASK DETAILS

4214839/D 11/2018

NOTES: (continued)

5.Publication IPC-7351 may have alternate designs.

6.Solder mask tolerances between and around signal pads can vary based on board fabrication site.

www.ti.com

 

EXAMPLE STENCIL DESIGN

DBV0005A

SOT-23 - 1.45 mm max height

 

SMALL OUTLINE TRANSISTOR

PKG

 

5X (1.1)

1

 

5X (0.6)

5

 

 

SYMM

2

(1.9)

2X(0.95)

 

3

4

(R0.05) TYP

(2.6)

 

 

SOLDER PASTE EXAMPLE

 

BASED ON 0.125 mm THICK STENCIL

 

SCALE:15X

4214839/D 11/2018

NOTES: (continued)

7.Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations.

8.Board assembly site may have different recommendations for stencil design.

www.ti.com

Источник: https://studfile.net/preview/16440195/