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f (MHz)

PL = 30 dBm.

ZS = ZL = 50 Ω; PD = 0 dBm; VS = 4.8 V; Tmb = 25 °C.

Fig.10 Control loop voltage gain as a function of the frequency on the control pin; typical values.

f (MHz)

PL = 25 dBm.

ZS = ZL = 50 Ω; PD = 0 dBm; VS = 4.8 V; Tmb = 25 °C.

Fig.11 Control loop voltage gain as a function of the frequency on the control pin; typical values.

f (MHz)

PL = 20 dBm.

ZS = ZL = 50 Ω; PD = 0 dBm; VS = 4.8 V; Tmb = 25 °C.

Fig.12 Control loop voltage gain as a function of frequency on the control pin; typical values.

f (MHz)

PL = 15 dBm.

ZS = ZL = 50 Ω; PD = 0 dBm; VS = 4.8 V; Tmb = 25 °C.

Fig.13 Control loop voltage gain as a function of frequency on the control pin; typical values.

SOLDERING

The indicated temperatures are those at the solder interfaces.

Advised solder types are types with a liquidus less than or equal to 210 °C.

Solder dots or solder prints must be large enough to wet the contact areas.

Footprints for soldering should cover the module contact area +0.1 mm on all sides.

Soldering can be carried out using a conveyor oven, a hot air oven, an infrared oven or a combination of these ovens.

Hand soldering must be avoided because the soldering iron tip can exceed the maximum permitted temperature of 250 °C and damage the module.

The maximum temperature profile and soldering time is indicated as follows (see Fig.16):

t = 350 s at 100 °C t = 300 s at 125 °C t = 200 s at 150 °C t = 100 s at 175 °C t = 50 s at 200 °C

t = 5 s at 250 °C (maximum temperature).

Cleaning

The following fluids may be used for cleaning:

∙Alcohol

∙Bio-Act (Terpene Hydrocarbon)

∙Triclean B/S

∙Acetone.

MLB740

300 handbook, halfpage

Tmb

(oC)

200

100

0

Fig.16 Maximum allowable temperature profile.