Материал: tvs2

NOTES:

1.DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.

2.CONTROLLING DIMENSION: INCH.

3.MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL.

STYLE 12:

PIN 1. CATHODE

2.CATHODE

3.ANODE

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Order this document by MMBZ15VDLT1/D

15 & 27 Volt SOT-23 Dual Monolithic Common

Cathode Zeners

Transient Voltage Suppressors for ESD Protection

These dual monolithic silicon zener diodes are designed for applications requiring transient overvoltage protection capability. They are intended for use in voltage and ESD sensitive equipment such as computers, printers, business machines, communication systems, medical equipment and other applications. Their dual junction common cathode design protects two separate lines using only one package. These devices are ideal for situations where board space is at a premium.

Specification Features:

•SOT±23 Package Allows Either Two Separate Unidirectional Configurations or a Single Bidirectional Configuration

•Peak Power Ð 40 Watts @ 1.0 ms (Bidirectional), per Figure 5 Waveform

•Maximum Clamping Voltage @ Peak Pulse Current

•Low Leakage < 100 nA

•ESD Rating of Class N (exceeding 16 kV) per the Human Body Model

Mechanical Characteristics:

•Void Free, Transfer±Molded, Thermosetting Plastic Case

•Corrosion Resistant Finish, Easily Solderable

•Package Designed for Optimal Automated Board Assembly

•Small Package Size for High Density Applications

•Available in 8 mm Tape and Reel

Use the Device Number to order the 7 inch/3,000 unit reel. Replace

the ªT1º with ªT3º in the Device Number to order the 13 inch/10,000 unit reel.

MMBZ15VDLT1

MMBZ27VCLT1

Motorola Preferred Devices

SOT±23

COMMON CATHODE

DUAL ZENER

OVERVOLTAGE

TRANSIENT SUPPRESSORS

40 WATTS

PEAK POWER

3

1

2

CASE 318±08

TO±236AB

LOW PROFILE SOT±23

1

3

2

TERMINAL 1 ± ANODE

TERMINAL 2 ± ANODE

TERMINAL 3 ± CATHODE

TEMPERATURE (°C)

Figure 1A. Typical Breakdown Voltage

versus Temperature

TEMPERATURE (°C)

Figure 1B. Typical Breakdown Voltage

versus Temperature

TEMPERATURE (°C)

Figure 2. Typical Leakage Current

versus Temperature

BIAS (V)

Figure 3. Typical Capacitance versus

Bias Voltage

Figure 4. Steady State Power Derating Curve

t, TIME (ms)

Figure 5. Pulse Waveform

Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to insure proper solder connection

interface between the board and the package. With the correct pad geometry, the packages will self align when subjected to a solder reflow process.

The power dissipation of the SOT±23 is a function of the drain pad size. This can vary from the minimum pad size for soldering to a pad size given for maximum power dissipation. Power dissipation for a surface mount device is determined

by TJ(max), the maximum rated junction temperature of the die, RθJA, the thermal resistance from the device junction to

ambient, and the operating temperature, TA. Using the values provided on the data sheet for the SOT±23 package, PD can be calculated as follows:

TJ(max) ± TA

PD = RθJA

The values for the equation are found in the maximum ratings table on the data sheet. Substituting these values into the equation for an ambient temperature TA of 25°C, one can calculate the power dissipation of the device which in this case is 225 milliwatts.

The 556°C/W for the SOT±23 package assumes the use of the recommended footprint on a glass epoxy printed circuit board to achieve a power dissipation of 225 milliwatts. There are other alternatives to achieving higher power dissipation from the SOT±23 package. Another alternative would be to use a ceramic substrate or an aluminum core board such as Thermal Clad . Using a board material such as Thermal Clad, an aluminum core board, the power dissipation can be doubled using the same footprint.

SOLDERING PRECAUTIONS

The melting temperature of solder is higher than the rated temperature of the device. When the entire device is heated to a high temperature, failure to complete soldering within a short time could result in device failure. Therefore, the following items should always be observed in order to minimize the thermal stress to which the devices are subjected.

•Always preheat the device.

•The delta temperature between the preheat and soldering should be 100°C or less.*

•When preheating and soldering, the temperature of the leads and the case must not exceed the maximum temperature ratings as shown on the data sheet. When

using infrared heating with the reflow soldering method, the difference shall be a maximum of 10°C.

•The soldering temperature and time shall not exceed 260°C for more than 10 seconds.

•When shifting from preheating to soldering, the maximum temperature gradient shall be 5°C or less.

•After soldering has been completed, the device should be allowed to cool naturally for at least three minutes. Gradual cooling should be used as the use of forced cooling will increase the temperature gradient and result in latent failure due to mechanical stress.

•Mechanical stress or shock should not be applied during cooling.

* Soldering a device without preheating can cause excessive thermal shock and stress which can result in damage to the device.